2.5D/3DArchitectureSolutionsforHBM2E/HBM3PackagingIntegrationApril6,2022MingLi,Ph.D.TechnicalDirector2CONFIDENTIAL•Introduction•AdvancedPackagingTechnologiesforHBMIntegration•HBMTechnologyDevelopment•RambusSiInterposerDesignsforHBM2/2E&HBM3Integration•SummaryContents3CONFIDENTIAL•Mainconsiderationsformemorysub-systeminHPCandAI/MLapplicationsarebandwidth,latency,andcapacity•ForapplicationswithparallelworkloadslikeHPCandAl-training,etc.,thememorybandwidthiscriticalforsystemperformance•HighBandwidthMemory(HBM),asitsnameimplies,emergedasleadingmemorysolutionforHPCandAItrainingapplications•HBMinitiallywasdesignedasnextgenerationgraphicmemoryafterGDDR5...